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AMD Opteron 6234 - OS6234WKTCGGU / OS6234WKTCGGUWOF information

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Type:CPU Manufacturer:AMD
family:Bulldozer microprocessors:Opteron 6200 series
Type CPU / Microprocessor
Market segment Server
Family
AMD Opteron *200 series
Model number    *234
CPU part numbers
  • OS*234WKTCGGU is an OEM/tray microprocessor
  • OS*234WKTCGGUWOF is a boxed processor without fan and heatsink
Frequency    2400 MHz
Turbo frequency 2*00 MHz (more than * cores)
3000 MHz (* cores or less)
Bus speed    3200 MHz HyperTransport links (*.4 GT/s per link)
Package 1*44-land lidded organic Land Grid Array (LGA)
Socket Socket G34
Introduction date November 14, 2011
Price at introduction $3**
Architecture / Microarchitecture
Microarchitecture Bulldozer
Platform Maranello
Processor core    Interlagos
Core stepping    OR-B2
Manufacturing process 0.032 micron silicon-on-insulator (SOI) technology
Die size 31*mm2
Data width *4 bit
The number of cores 12
The number of threads 12
Floating Point Unit Integrated (shared between two cores in each module)
Level 1 cache size    * x *4 KB 2-way set associative shared instruction caches
12 x 1* KB 4-way set associative data caches
Level 2 cache size    * x 2 MB 1*-way set associative shared exclusive caches
Level 3 cache size 2 x 8 MB up to *4-way set associative shared caches
Cache latency 3 (L1 cache)
Multiprocessing Up to 4 processors
Features
  • MMX instructions
  • Extensions to MMX
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • SSE4a   
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • FMA4 / 4-operand Fused Multiply-Add instructions
  • XOP / eXtended Operations instructions
  • AMD*4 / AMD *4-bit technology   
  • AMD-V 2.0 / AMD Virtualization technology 2.0
  • EVP / Enhanced Virus Protection   
  • Turbo Core technology
Low power features AMD-P 2.0:
  • Core C1, C1E, C* and CC* states
  • Package S3, S4 and S5 states
  • TDP power cap
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 2
Memory channels per controller: 2
Channel width (bits): *2
Supported memory: UDDR3-1*00, RDDR3-1*00, ULV RDDR3-1333, LRDIMM-1333
DIMMs per channel: 3
Maximum memory bandwidth (GB/s): 51.2
Other peripherals HyperTransport 3.0 technology with 4 HT links
Electrical / Thermal parameters
Maximum operating temperature    *0.4°C
Average CPU Power 80 Watt
Thermal Design Power    115 Watt
Notes on AMD Opteron *234
  • Die size is per die. The package houses two dies


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